![]() ![]() Root Causes Analysis Impedance model With FR4 Dielectric: So the electromagnetic field density is not uniform.ħ 3. The electromagnetic field density will be different if anyone parameter changed. Root Causes Analysis Impedance model: the nature of electromagnetic field. ![]() Hard to directly measure the Dk after lamination due to the Dk has been changed Summary: DK is variable there is pure resin filled layer surrounds the trace.Ħ 3. Hard to define the DK of multiply PP combination after lamination pressed (3). FR4 is mixture dielectric with glass fiber(DK:4.0~6.5) and resin (DK:2.0~3.5). Root Causes Analysis Dielectric constant (Dk): Copper thickness Trace Width / Space Dielectric height (Stackup/PP, core) DK Dissipation factor (DF) Roughness of copper Surface treatment (OSP, HASL, ENIG, etc) Others (Humidity, Temperature ) Impedance Insertion Loss Difficulty The cross section parameters : H,W,T can be directly measured, but DK is an exception.ĥ 3. Key Factors: Dielectric thickness (H), Width (W), Copper thickness (T), Dielectric constant (DK). Specific stackup design/simulation almost be considered as a secret on PCB house. High cost repeated trial runs for empirical DK extraction/material characterization. Issues of specific stackup simulationĭesign and simulation of PCB impedance & insertion loss for a specific stackup is challenging There is 5%~10% impedance off between cross-section model and measurement. Issues of specific stackup design/simulationĢ. Presentation on theme: "ShenZhen SiSolver Technologies Co.Ltd"- Presentation transcript:Ĭost-effective PCB Impedance & Insertion Loss Simulation for a Specific Stackup ShenZhen SiSolver Technologies Co.LtdĢ Content 1. ![]()
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